Solder Reflow Station – SRO-700

Solder Reflow Station

The Solder Reflow Station is ideal for R&D, process development as well for low to high volume production.

It includes fast heated plate ramping, and a rapid single wafer processing capability of > 20°C/second.

Some applications include:

  • Die attachment 
  • High vacuum encapsulation 
  • MEMS package sealing, IR sensor/Crystal package sealing
  • Wafer level packaging 
  • Low moisture package sealing 
  • High power LED 
  • Laser bar
  • Wafer bump/solder ball reflow
  • Diffusion bonding 
  • CPV
  • Thermo compression bonding


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